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Pressemitteilungen zu dem Thema serdes


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PresseMitteilungen zu dem Schlagwort serdes


Kandou Recognized for "Best European Paper" at ISSCC 2015

SAN FRANCISCO, CA -- (Marketwired) -- 03/02/15 -- Kandou Bus received the Jan Van Vessem Award for Outstanding European Paper last week at the International Solid-State Circuits Conference. The Solid-State Circuits Society (SSCS) of the Institute of Electrical and Electronics Engineers (IEEE) recognized Kandou for their 2014 paper entitled "A Pin- and Power-Efficient Low-Latency 8-to-12Gb/s/wire 8b8w-Coded SerDes Link for High-Loss Channels in 40nm Technology." Founder and CEO Amin Sh ...


02.03.2015

Achronix Dramatically Reduces Compile Times With New Incremental Compile Support in Its ACE Design Tools

SANTA CLARA, CA -- (Marketwired) -- 02/18/15 -- Achronix Semiconductor Corporation today announced the immediate availability of its latest tool suite, the Achronix CAD Environment (ACE) version 5.4, which now contains support for incremental compilation.Incremental compilation dramatically increases productivity by allowing FPGA designers to compile portions of their design that have changed while leaving the remainder of their design intact. Incremental changes to a design can be passed throu ...


18.02.2015

Achronix Announces Production Availability of Speedster22i Product Family

SANTA CLARA, CA -- (Marketwired) -- 02/17/15 -- Achronix Semiconductor Corporation today announced that the Speedster22i family of FPGAs has transitioned into production status. The Speedster22i FPGA family is built on Intel''s 22nm Tri-Gate process technology and consists of three device members, two of which have entered production -- the HD680 with 660 thousand effective look-up-tables (LUTs) and the HD1000 with 1 million effective LUTs.Speedster22i FPGAs combines the most advanced ...


17.02.2015

Kandou Introduces High Bandwidth, Low Power, In-Package Chip Interconnect Enabling Lower Cost Semiconductor Solutions

LAUSANNE, SWITZERLAND -- (Marketwired) -- 11/03/14 -- Kandou Bus has announced the Glasswing™ family of chip interconnects targeted for in-package chip-to-chip links. Kandou introduced Chord™ Signaling in February 2014 and outlined how signals can be correlated across more than two wires to achieve higher bandwidth and lower power with excellent signal integrity and low latency. The Glasswing architecture optimizes Chord Signaling to address the unique challenges of both substrate and interpose ...


03.11.2014

eSilicon Expands SerDes IP Licensing Agreement With Avago Technologies

SUNNYVALE, CA -- (Marketwire) -- 02/07/12 -- eSilicon Corporation, the largest independent semiconductor value chain producer (VCP), announced today that eSilicon has expanded its existing agreement with Avago Technologies to include access to Avago's 28nm, 40nm, 65nm and 90nm embedded SerDes cores. The agreement allows eSilicon to offer these high-performance cores and related IP as part of its custom chip development solution, positioning it to address the growing communications and sto ...


07.02.2012



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